通富微电：具备Chiplet封装技术 先进封装收入占比超过70%

array(1) { [427438]=> array(2) { [2]=> array(2) { [0]=> string(12) "通富微电" [1]=> string(13) "Chiplet概念" } [4]=> array(1) { [0]=> string(19) "同花顺7x24快讯" } } }